For copper-plating aluminium, the bath may be cyanide of copper, 6 parts (by weight); cyanide of potassium, 9 parts; phosphate of soda, 9 parts; and water, 100 parts. For gold-plating, chloride of gold, 2 parts; cyanide of potassium, 2 parts; phosphate of soda, 2 parts; and water, 100 parts. For nickel-plating, chloride of nickel, 7 parts; phosphate of soda, 7 parts; and water, 100 parts. For silver-plating, nitrate of silver, 2 parts; cyanide of potassium, 4 parts; phosphate of soda, 4 parts; and water, 100 parts. Keep the hath whilst plating at a temperature of from 140° to 158° F. (60° to 70' C). For the anode, use a strip of the metal which is to be deposited. The baths given above are on the authority of Lanseigne and Leblanc.